Transition Metals
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Platinum foil, 0.25mm (0.01in) thick, 99.9% (metals basis)
CAS: 6-4-7440 Molecular Formula: Pt Molecular Weight (g/mol): 195.08 MDL Number: MFCD00011179 InChI Key: BASFCYQUMIYNBI-UHFFFAOYSA-N Synonym: black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion PubChem CID: 23939 ChEBI: CHEBI:33400 IUPAC Name: platinum SMILES: [Pt]
| PubChem CID | 23939 |
|---|---|
| CAS | 6-4-7440 |
| Molecular Weight (g/mol) | 195.08 |
| ChEBI | CHEBI:33400 |
| MDL Number | MFCD00011179 |
| SMILES | [Pt] |
| Synonym | black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion |
| IUPAC Name | platinum |
| InChI Key | BASFCYQUMIYNBI-UHFFFAOYSA-N |
| Molecular Formula | Pt |
Platinum on activated carbon, 5% Pt
CAS: 6-4-7440 Molecular Formula: Pt Molecular Weight (g/mol): 195.08 MDL Number: MFCD00011179 InChI Key: BASFCYQUMIYNBI-UHFFFAOYSA-N Synonym: black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion PubChem CID: 23939 ChEBI: CHEBI:33400 IUPAC Name: platinum SMILES: [Pt]
| PubChem CID | 23939 |
|---|---|
| CAS | 6-4-7440 |
| Molecular Weight (g/mol) | 195.08 |
| ChEBI | CHEBI:33400 |
| MDL Number | MFCD00011179 |
| SMILES | [Pt] |
| Synonym | black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion |
| IUPAC Name | platinum |
| InChI Key | BASFCYQUMIYNBI-UHFFFAOYSA-N |
| Molecular Formula | Pt |
Platinum wire, 1.5mm (0.059in) dia, hard, 99.95% (metals basis)
CAS: 6-4-7440 Molecular Formula: Pt Molecular Weight (g/mol): 195.08 MDL Number: MFCD00011179 InChI Key: BASFCYQUMIYNBI-UHFFFAOYSA-N Synonym: black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion PubChem CID: 23939 ChEBI: CHEBI:33400 IUPAC Name: platinum SMILES: [Pt]
| PubChem CID | 23939 |
|---|---|
| CAS | 6-4-7440 |
| Molecular Weight (g/mol) | 195.08 |
| ChEBI | CHEBI:33400 |
| MDL Number | MFCD00011179 |
| SMILES | [Pt] |
| Synonym | black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion |
| IUPAC Name | platinum |
| InChI Key | BASFCYQUMIYNBI-UHFFFAOYSA-N |
| Molecular Formula | Pt |
Platinum, 5% on activated carbon paste, B103032-5
CAS: 6-4-7440 Molecular Formula: Pt Molecular Weight (g/mol): 195.08 MDL Number: MFCD00011179 InChI Key: BASFCYQUMIYNBI-UHFFFAOYSA-N Synonym: black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion PubChem CID: 23939 ChEBI: CHEBI:33400 IUPAC Name: platinum SMILES: [Pt]
| PubChem CID | 23939 |
|---|---|
| CAS | 6-4-7440 |
| Molecular Weight (g/mol) | 195.08 |
| ChEBI | CHEBI:33400 |
| MDL Number | MFCD00011179 |
| SMILES | [Pt] |
| Synonym | black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion |
| IUPAC Name | platinum |
| InChI Key | BASFCYQUMIYNBI-UHFFFAOYSA-N |
| Molecular Formula | Pt |
Platinum sponge, 2mm (0.08in) & down, 99.9% (metals basis)
CAS: 6-4-7440 Molecular Formula: Pt Molecular Weight (g/mol): 195.08 MDL Number: MFCD00011179 InChI Key: BASFCYQUMIYNBI-UHFFFAOYSA-N Synonym: black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion PubChem CID: 23939 ChEBI: CHEBI:33400 IUPAC Name: platinum SMILES: [Pt]
| PubChem CID | 23939 |
|---|---|
| CAS | 6-4-7440 |
| Molecular Weight (g/mol) | 195.08 |
| ChEBI | CHEBI:33400 |
| MDL Number | MFCD00011179 |
| SMILES | [Pt] |
| Synonym | black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion |
| IUPAC Name | platinum |
| InChI Key | BASFCYQUMIYNBI-UHFFFAOYSA-N |
| Molecular Formula | Pt |
| Name Note | 0.5mm (0.02 in.) dia., Hard, Temper: as drawn |
|---|---|
| Form | Wire |
| MDL Number | MFCD02091683 |
| Solubility Information | Insoluble in water |
| Chemical Name or Material | Platinum Iridium wire |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Odor | Odorless |
| Weight | ≈0.44g/10cm |
| Avg. Mol. Wt. or Mol. Wt. Range | Pt:Ir; 80:20 wt% |
Scandium rod, 12.7mm (0.5in) dia, 99.6% (metals basis excluding Ta)
CAS: 7440-20-2 Molecular Formula: Sc Molecular Weight (g/mol): 44.96 MDL Number: MFCD00016323 InChI Key: SIXSYDAISGFNSX-UHFFFAOYSA-N Synonym: unii-yuj4u1ew7r,yuj4u1ew7r,escandio,skandium,atom,powder,ingot,nitrate solution,standard for aas,scandium, lump, vacuum remelted PubChem CID: 23952 ChEBI: CHEBI:33330 IUPAC Name: scandium SMILES: [Sc]
| PubChem CID | 23952 |
|---|---|
| CAS | 7440-20-2 |
| Molecular Weight (g/mol) | 44.96 |
| ChEBI | CHEBI:33330 |
| MDL Number | MFCD00016323 |
| SMILES | [Sc] |
| Synonym | unii-yuj4u1ew7r,yuj4u1ew7r,escandio,skandium,atom,powder,ingot,nitrate solution,standard for aas,scandium, lump, vacuum remelted |
| IUPAC Name | scandium |
| InChI Key | SIXSYDAISGFNSX-UHFFFAOYSA-N |
| Molecular Formula | Sc |
Copper wire, 0.1mm (0.004in) dia, hard, Puratronic™, 99.9985% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper foil, 0.5mm (0.02in) thick, Puratronic™, 99.998% (metals basis), Oxygen free
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper gauze, 100 mesh woven from 0.11mm (0.0045in) dia wire
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper powder, -40+100 mesh, 99.5% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper foil, 0.5mm (0.02in) thick, Puratronic™, 99.9999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper Metal, Shot, 99.9%, Spectrum™ Chemical
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CAS: 7440-50-8 Molecular Weight (g/mol): 63.54
| CAS | 7440-50-8 |
|---|---|
| Molecular Weight (g/mol) | 63.54 |
| Name Note | 0.25mm (0.01 in.) dia. |
|---|---|
| Form | Wire |
| MDL Number | MFCD00801098 |
| Chemical Name or Material | Copper Nickel wire |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Weight | ≈0.44g/m |
| Avg. Mol. Wt. or Mol. Wt. Range | Cu:Ni 55:45 wt% |
Copper turnings, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |