CAS RN 7440-50-8
Copper AA Standard, 1000 ppm Cu in 3% HNO3, Ricca Chemical
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper, 99+%, turnings
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper turnings, 99+% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper powder, -625 mesh, APS 3.25-4.75 micron, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper powder, spherical, -100 mesh, 99.5% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper wire, 1.5mm (0.06in) dia, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper powder, spherical, -170+400 mesh, 99.9% (metals basis), Oxygen <1000ppm
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper wire, 0.25mm (0.01in) dia, Puratronic™, 99.9999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper powder, -40+100 mesh, 99.5% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper foil, 0.025mm (0.001in) thick, Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper wire, 0.5mm (0.02in) dia, annealed, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper gauze, 50 mesh woven from 0.23mm (0.009in) dia wire
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper powder, -150 mesh, 99.5% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper foil, 0.254mm (0.010in) thick, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper foil, 0.1mm (0.004in) thick, Puratronic™, 99.9999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]