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Electron Microscopy Sciences Epo-Tek H22 Adhesive 1 OZ
Supplier: Electron Microscopy Sciences 1267322
Epo-Tek H22 is a two component, silver-filled epoxy system, designed for die bonding and sealing hybrid circuit and recommended for SEM small angle cleavage and wafer bonding.
Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature. Smooth, free-flowing, slightly thixotropic paste. High Tg allows it to be used for high temperature applications (≤300 degree C). Contains no solvents – It is a NASA approved low outgasing epoxy. Excellent resistance to solvents, chemicals and moisture. Extended pot life and fast curing at low temperature <100 degree C.
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