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Electron Microscopy Sciences Wafer Cleaving Kit
SDP

Catalog No. 501902663
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The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing (straight tip and 30 degree tip), a pen-style diamond scribe, tweezers with black soft fiber fine tip (length 6.25 in), wafer cleaning pliers, a clear plastic ruler with metric and US units, and tungsten cleaving wire. This kit is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).

Catalog No. 50-190-2663 Supplier Electron Microscopy Sciences Supplier No. 7642
May include imposed supplier surcharges.
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The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing (straight tip and 30 degree tip), a pen-style diamond scribe, tweezers with black soft fiber fine tip (length 6.25 in), wafer cleaning pliers, a clear plastic ruler with metric and US units, and tungsten cleaving wire. This kit is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).

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