Salts and Inorganics
A variety of inorganic salts and elemental metals that can be used for large-scale, industrial purposes and everyday laboratory applications. Products are available in a range of chemical compositions, quantities, purities, and reagent grades.
Inorganics are elements and compounds, including carbon monoxide, carbon dioxide, carbonates, cyanides, cyanates, and carbides, that do not contain a carbon-hydrogen bond. This group also includes carbon allotropes such as graphite and graphene.
Because organic chemicals include only those that contain carbon atoms bonded to hydrogen atoms, the majority of elements in the periodic table and most substances in the material world are considered to be inorganic chemicals.
Filtered Search Results
| Name Note | 1.0mm (0.04 in.) dia. |
|---|---|
| Form | Wire |
| MDL Number | MFCD01866121 |
| Chemical Name or Material | Copper Manganese Nickel wire |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Weight | ≈6.6g/m |
| Avg. Mol. Wt. or Mol. Wt. Range | Cu:Mn:Ni; 84:12:4 wt% |
Reagents Holdings Llc Copper (II) Sulfate, 2% w/v, Reagents
CAS: 7732-18-5 Molecular Formula: H2O Molecular Weight (g/mol): 18.02 InChI Key: XLYOFNOQVPJJNP-UHFFFAOYSA-N Synonym: Copper(II) Sulfate IUPAC Name: water SMILES: O
| CAS | 7732-18-5 |
|---|---|
| Molecular Weight (g/mol) | 18.02 |
| SMILES | O |
| Synonym | Copper(II) Sulfate |
| IUPAC Name | water |
| InChI Key | XLYOFNOQVPJJNP-UHFFFAOYSA-N |
| Molecular Formula | H2O |
Reagents Holdings Llc Copper Sulfate Solution, ASTM A380/A967, Reagents
Copper Sulfate Solution, ASTM A380/A967, Reagent, for general laboratory use. Manufactured in ISO 9001 facility.
| Boiling Point | 100°C |
|---|---|
| Percent Purity | 1.6% |
| CAS | 7758-99-8 |
| Color | Blue |
| Packaging | Poly Bottle |
| Physical Form | Liquid |
| pH | <1 |
| Chemical Name or Material | Copper Sulfate Solution, ASTM A380/A967 |
| Grade | Reagent |
| Synonym | Copper(II) Sulfate |
| Molecular Formula | CuSO4/H2O/H2SO4 |
| Specific Gravity | 1.01 |
Copper(II) Oxide, Granular, For Elementary Analysis, MilliporeSigma™
CAS: 1317-38-0 Molecular Formula: CuO Molecular Weight (g/mol): 79.55 MDL Number: MFCD00010979 InChI Key: KKCXRELNMOYFLS-UHFFFAOYSA-N Synonym: cupric oxide,copper ii oxide,copper oxide,copper monoxide,banacobru ol,chrome brown,copper brown,copper monooxide,black copper oxide PubChem CID: 14829 IUPAC Name: copper(2+) oxidandiide SMILES: [O--].[Cu++]
| PubChem CID | 14829 |
|---|---|
| CAS | 1317-38-0 |
| Molecular Weight (g/mol) | 79.55 |
| MDL Number | MFCD00010979 |
| SMILES | [O--].[Cu++] |
| Synonym | cupric oxide,copper ii oxide,copper oxide,copper monoxide,banacobru ol,chrome brown,copper brown,copper monooxide,black copper oxide |
| IUPAC Name | copper(2+) oxidandiide |
| InChI Key | KKCXRELNMOYFLS-UHFFFAOYSA-N |
| Molecular Formula | CuO |
Copper Sulfate, Certified, 1.186 ±0.003, LabChem™
CAS: 7758-99-8 Molecular Formula: CuH10O9S Molecular Weight (g/mol): 249.68 MDL Number: MFCD00149681 InChI Key: JZCCFEFSEZPSOG-UHFFFAOYSA-L Synonym: copper ii sulfate pentahydrate,copper sulfate pentahydrate,cupric sulfate pentahydrate,blue vitriol,calcanthite,bluestone,copper 2+ sulfate pentahydrate,triangle,vencedor,blue copperas PubChem CID: 24463 ChEBI: CHEBI:31440 IUPAC Name: copper(2+) pentahydrate sulfate SMILES: O.O.O.O.O.[Cu++].[O-]S([O-])(=O)=O
| PubChem CID | 24463 |
|---|---|
| CAS | 7758-99-8 |
| Molecular Weight (g/mol) | 249.68 |
| ChEBI | CHEBI:31440 |
| MDL Number | MFCD00149681 |
| SMILES | O.O.O.O.O.[Cu++].[O-]S([O-])(=O)=O |
| Synonym | copper ii sulfate pentahydrate,copper sulfate pentahydrate,cupric sulfate pentahydrate,blue vitriol,calcanthite,bluestone,copper 2+ sulfate pentahydrate,triangle,vencedor,blue copperas |
| IUPAC Name | copper(2+) pentahydrate sulfate |
| InChI Key | JZCCFEFSEZPSOG-UHFFFAOYSA-L |
| Molecular Formula | CuH10O9S |
Copper wire, 0.1mm (0.004in) dia, hard, Puratronic™, 99.9985% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper foil, 0.25mm (0.01in) thick, hard, Puratronic™, 99.999+% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper shot, 3-6mm (0.12-0.24in), Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper foil, 0.25mm (0.01in) thick, annealed, 99.95% (metals basis), oxygen free
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper powder, -625 mesh, APS 2-3.50 micron, 99% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper wire, 0.64mm (0.025in) dia, Puratronic™, 99.999% (metals basis), Oxygen free
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper tubing, 3.175mm (0.125in) OD, 1.5mm (0.059in) ID, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
| Name Note | 0.81mm (0.032 in.) thick |
|---|---|
| Form | Foil |
| Health Hazard 3 | P201-P202-P260-P264b-P270-P272-P280g-P281-P302+P352-P308+P313-P333+P313-P363-P501c |
| MDL Number | MFCD00801098 |
| Health Hazard 2 | GHS H Statement H351-H317 Suspected of causing cancer. May cause an allergic skin reaction. |
| Health Hazard 1 | H317-H350-H372 |
| Chemical Name or Material | Nickel Copper foil, Alloy 400 |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Avg. Mol. Wt. or Mol. Wt. Range | Ni:Cu; 67:33 wt% |