Polishing and Abrasive Compounds
Electron Microscopy Sciences Diamond Lapping Film 12", Plain Backing, 1 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 1 µm
Electron Microscopy Sciences Diamond Lapping Film 12", Plain Backing, 15 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 15 µm
Electron Microscopy Sciences Diamond Lapping Film 12", Plain Backing, 0.25 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 0.25 µm
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 9 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 9 µm
Electron Microscopy Sciences Diamond Lapping Film 12", Plain Backing, 30 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 30 µm
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 0.1 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 0.1 µm
Electron Microscopy Sciences Aluminum Oxide Abrasive Discs 8", Plain backing
Alumina is widely used in sample grinding and polishing. Our Aluminum Oxide Abrasive film with a PSA back or a plain back are ready to use in all sample polishing applications.
Backing: Plain
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 0.5 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 0.5 µm
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 3 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 3 µm
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 1 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 1 µm
Electron Microscopy Sciences Diamond Lapping Film 12", Plain Backing, 0.5 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 0.5 µm
Electron Microscopy Sciences Diamond Lapping Film 12", Plain Backing, 6 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 6 µm
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 6 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 6 µm
Electron Microscopy Sciences Diamond Lapping Film 12", Plain Backing, 3 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 3 µm
Electron Microscopy Sciences Diamond Lapping Film 12", Plain Backing, 9 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 9 µm
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