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Sigma Aldrich 4-(2-Methoxyphenyl)pyrimidin-2-amine
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Description
- Benzocyclobutene was used as the adhesive bonding material in adhesive wafer-level bonding technique
- Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications
- It was used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric
Specifications
Specifications
| CAS | 915070-01-8 |
| Molecular Formula | C11H11N3O |
| Linear Formula | C11H11N3O |
| MDL Number | MFCD07381837 |
| Quantity | 500 mg |
| Molecular Weight (g/mol) | 201.22 |
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