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Copper etchant
Description
Iron (III) chloride solution for immersion etching copper, copper alloys and Kovar in printed circuit board applications
This Thermo Scientific Chemicals brand product was originally part of the Alfa Aesar product portfolio. Some documentation and label information may refer to the legacy brand. The original Alfa Aesar product / item code or SKU reference has not changed as a part of the brand transition to Thermo Scientific Chemicals.

Specifications
Specifications
Chemical Name or Material | Copper etchant |
Density | 1.19 |
Quantity | 1 qt. |
Form | Liquid |
MDL Number | MFCD00161912 |
Frequently Asked Questions (FAQs)
Copper etchant has an etch rate of 1 mil/minute at 40 degrees C (etches 1 oz copper in 90 seconds).
Undercutting of the etchant can be reduced by increasing the rate of stirring or agitation.
No, it is a ready-to-use solution. Dilution will only be necessary if you want to reduce the etch rate.
The etch rate of the etchant can be reduced by adding 1 part deionized water to 2 parts etchant. This will reduce the etch rate approximately 50%.
The etch rate of the etchant will be increased by increasing the rate of stirring or agitation.
RUO – Research Use Only
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