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Electron Microscopy Sciences Precision Diamond Wafer Blade 3", Medium grit with High Concentration, 0.010" thick
SDP

Supplier:  Electron Microscopy Sciences 50266MH3

Encompass_Preferred

These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements. Outer rim bonded with w/medium diamond particles. A high concentration of diamonds is for general laboratory use with low or high saw's speed.
Particles: Medium
Concentration: High
Thickness: 0.010"

Catalog No. 50-997-209


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