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Electron Microscopy Sciences Precision Diamond Wafer Blade 4", Coarse High Concentration, 0.020" thick
SDP

Catalog No. 50997212
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These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements. A high concentration of coarse diamond particles is for general laboratory use with low or high saw's speed.
Particles: Coarse High
Thickness: 0.020"

Catalog No. 50-997-212 Supplier Electron Microscopy Sciences Supplier No. 50267CH4
May include imposed supplier surcharges.
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These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements. A high concentration of coarse diamond particles is for general laboratory use with low or high saw's speed.
Particles: Coarse High
Thickness: 0.020"

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