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Electron Microscopy Sciences Precision Diamond Wafer Blade 4", Fine grit with High Concentration, 0.020" thick

Supplier: Electron Microscopy Sciences 50267FH4
These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements. A high concentration of fine diamond particles is for general laboratory use with low or high saw's speed.
Particles: Fine
Concentration: High
Thickness: 0.020"
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