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Electron Microscopy Sciences Precision Diamond Wafer Blade 7", Coarse grit with Low Concentration, 0.029" thick
SDP

Supplier:  Electron Microscopy Sciences 50266CL7

Encompass_Preferred

These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements. Outer rim bonded w/coarse diamond particles. A low concentration of diamonds is for sectioning hard, brittle materials, such as ceramics and minerals.
Particles: Coarse
Concentration: Low
Thickness: 0.029"

Catalog No. 50-997-207


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