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Electron Microscopy Sciences EMS Gold Epoxy Paste 2 GR
SDP

Supplier:  Electron Microscopy Sciences 1264001

Encompass_Preferred

This EMS one part Epoxy Gold Paste is a gold-filled conductive bonding, exhibiting high electrical conductivity and bond strength. It is used in preference to silver-epoxy or other silver preparations to avoid silver migration problems, or when a higher signal is required.

The Gold Paste is well suited to all SEM work, and it bonds well to alumina ceramic substrate, phenolic circuit boards, and transistor headers. It is also useful in a variety of applications in solid state and hybrid circuits including attachment, bonding semiconductor devices, heat sinks, capacitor chips.

Catalog No. 50-344-02


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