Sigma Aldrich High speed bright copper electroplating solution

Catalog No.	Quantity
90-056-9500ML	500 mL

Catalog No. 90-056-9500ML Supplier Sigma Aldrich Supplier No. 900569500ML

Description

MilliporeSigma Sigma Organics products encompass a wide range of quality reagents, solvents, catalysts, and building blocks for organic synthesis. From benchtop discovery to process development and scale-up, Sigma Organics solutions are built to meet the needs of synthetic chemists.

High speed bright copper electroplating solution is an electrolytic acid copper process engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vials and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. This copper electroplating solution is made up of cupric sulphate and sulphuric acid with small additions of hydrochloric acid and organic additives. The organic additives have a wide concentration process window eliminating the need for separate additive solutions and replenishment for about 120 Amp-hours of electroplating.

Specifications

• Quantity: 500 mL
• Percent Purity: 40 mg/L ±4 mg/L chloride basis; 600 mg/L ±60 mg/L (organic additives); 65.0 g/L ±2 g/L Cu basis; 8.0 g/L ±0.4 g/L H2SO4 basis