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Electron Microscopy Sciences M-Bond System, M-Bond 600, 1 kit
SDP

Supplier:  Electron Microscopy Sciences 5041020

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The M-Bond adhesives are high-performance epoxy resins, which are formulated especially for bonding strain gages and special-purpose sensors. When properly cured, these adhesives are useful in temperatures ranging from -452F to +350 F (-269C to+ 175C) with M-Bond 43-B, and to +700F (+370C) for short periods with M-bond 600 and 610. In common with other organic materials, oxidation and sublimation effects at elevated temperatures limit life. Shelf Life: 3 months.
Curing time: 3.5 hours at +350F (170C)
Package: 4 x 10 ml A and 4 x 15 ml B

Catalog No. 50-905-3763


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