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Electron Microscopy Sciences Thermally Conductive Adhesive ETC Bond 860 25 GR
SDP

Supplier:  Electron Microscopy Sciences 50380860

Encompass_Preferred

Thermally conductive adhesive, Aluminum nitride filled, 1:1 epoxy paste, Excellent mechanical & thermal properties to 400 deg F.

Catalog No. 50-997-388


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