Polishing and Abrasive Compounds
Electron Microscopy Sciences Lapping & Polishing Fixture Cutting Weight 600g
Weight for use with lapping and polishing fixtures.
Electron Microscopy Sciences Lapping & Polishing Fixture Cutting Weight 20g
Weight for use with lapping and polishing fixtures.
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 15 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 15 µm
Electron Microscopy Sciences Diamond Lapping Film 8", PSA Backing, 0.1 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: PSA
Particles: 0.1 µm
Electron Microscopy Sciences Diamond Lapping Film 12", PSA Backing, 0.25 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: PSA
Particles: 0.25 µm
Electron Microscopy Sciences Glennel Diamond Paste UBS Water/Oil Soluble, Polycrystalline 0.1 µm 5 GR
Glennel diamond products are specially formulated to help you prepare surfaces that are usually difficult to polish and require precision finish. To satisfy today's demand the diamond compounds must be complex with near perfect tolerances as is ours. Excellent for most applications. used for microscopy.
Type: Polycrystalline
Size: 0.1 µm
Electron Microscopy Sciences Glennel Diamond Paste UB Water/Oil Soluble, Monocrystalline 0.1 µm 5 GR
Glennel diamond products are specially formulated to help you prepare surfaces that are usually difficult to polish and require precision finish. To satisfy today's demand the diamond compounds must be complex with near perfect tolerances as is ours. Excellent for most applications.
Type: Monocrystalline
Size: 0.1 µm
Buehler CARBIMET PSA, 320, 8IN
This item has a minimum qty of 2 per supplier requirements.
Carbimet PSA, 320, 8in
Electron Microscopy Sciences Silicone Carbide Abrasive Film Disc, 5 µm, PSA backing
Silicon carbide abrasive film discs are ready to use for polishing and grinding. Discs are 8" in diameter.
Particles: 5 µm
Backing: PSA
Electron Microscopy Sciences Silicone Carbide Abrasive Film Disc, 15 µm, Plain Back
Silicon carbide abrasive film discs are ready to use for polishing and grinding. Discs are 8" in diameter.
Particles: 15 µm
Backing: Plain
Electron Microscopy Sciences Silicone Carbide Abrasive Film Disc, 3 µm, Plain Back
Silicon carbide abrasive film discs are ready to use for polishing and grinding. Discs are 8" in diameter.
Particles: 3 µm
Backing: Plain
Electron Microscopy Sciences Silicone Carbide Abrasive Film Disc, 1 µm, Plain Back
Silicon carbide abrasive film discs are ready to use for polishing and grinding. Discs are 8" in diameter.
Particles: 1 µm
Backing: Plain
Electron Microscopy Sciences Silicone Carbide Powder, 8 µm particles 1 LB
Dark gray 98% SiC. Hardness, Moh's scale 9.0; Knoop Scale 2500. Crystallography: hexagonal–alpha and beta phase.
Size: 8 µm
Electron Microscopy Sciences Diamond Lapping Film 8", PSA Backing, 0.5 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: PSA
Particles: 0.5 µm