Hydrogen peroxide solution, Honeywell™

Description

Semiconductor grade (Honeywell 17948), ≥30%

• comprehensive portfolio for the electronics and semiconductor industry
• for scientists engaged in education, research, development, prototyping and small scale fabrication of high tech micro- and nanochips
• Superior purity, stability and exceptional lot-to-lot consistency
• includes high purity products required for high performance applications such as etchants, solvents or hexamethyldisilazane (HMDS)

Specifications

• CAS: 7722-84-1,7732-18-5
• CAS Min %: 68.90%,30.00%
• CAS Max %: 69.90%,31.00%
• Aluminum (Al): Max. 0.2 ppm
• Arsenic (As): Max. 0.01 ppm
• Barium (Ba): Max. 0.1 ppm
• Boron (B): Max. 0.02 ppm
• Cadmium (Cd): Max. 0.01 ppm
• Calcium (Ca): Max. 0.5 ppm
• Molecular Formula: H2O2
• Chloride: Max. 0.5 ppm
• Chromium (Cr): Max. 0.01 ppm
• Copper (Cu): Max. 0.01 ppm
• InChI Key: MHAJPDPJQMAIIY-UHFFFAOYSA-N
• SMILES: OO
• IUPAC Name: peroxol
• Molecular Weight (g/mol): 34.01
• PubChem CID: 784
• ChEBI: CHEBI:16240
• Free Acid: Max. 50 ppm
• Physical Form: Liquid
• Iron (Fe): Max. 0.1 ppm
• Manganese (Mn): Max. 0.01 ppm
• Magnesium (Mg): Max. 0.1 ppm
• Nickel (Ni): Max. 0.01 ppm
• Packaging: Plastic Bottle
• Phosphate: Max. 1 ppm
• Potassium (K): Max. 0.1 ppm
• Silver (Ag): Max. 0.02 ppm
• Sulfate: Max. 2 ppm
• Tin (Sn): Max. 0.02 ppm
• Titanium (Ti): Max. 0.01 ppm
• Zinc (Zn): Max. 0.05 ppm
• Boiling Point: Decomposes on heating.
• Quantity: 5 l
• Grade: Semiconductor grade reagent

Safety and Handling

Recommended Storage : Room Temperature