The PDC-001-HP High Power Expanded Plasma Cleaner is a versatile instrument, suitable for etching organic thin films (10-100 nm thickness) as well as nanoscale cleaning and surface modification. Maximum RF power of 45W; Adjustable RF power settings (LOW, MEDIUM, HIGH); LOW RF power is equivalent to HIGH RF power setting on PDC-001; 6in. diameter x 6.5in. length Pyrex chamber; Hinged door with viewing window; Active fan cooling; Integral switch for a vacuum pump; Metering valve to qualitatively control gas flow and vacuum pressure; Three-way valve to quickly switch from bleeding in gas, isolating the chamber, and venting; Size: 11in. H x 18in. W x 9in. D; Weight: 37 lb. REQUIRED: A separate vacuum pump (minimum pump speed 23 L/min, ultimate total pressure of 200 mTorr or less) is required to run the plasma process.