Electron Microscopy Grids, Mesh, and Films
Ted Pella Inc Ultra-Flat Thermal SiO2 Substrates, 200nm Thermal Oxide on 5 x 5mm diced Ultra-Flat Wafer, Type <100>, in Gel-Pak® box
The Ultra-Flat SiO2 substrates consist of a 200nm thermally grown amorphous SiO2 film on an ultra-flat silicon wafer. SiO2 is one of the most characterized materials and is widely used in semiconductor manufacturing, thin film research and as substrate for growing cells. It can be directly used as substrate for AFM and SEM imaging. The ultra-flat thermal silicon dioxide substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier, the diced pieces are shipped in a Gel-Pak® box.The special clean dicing process involves coating the wafer with photo resist before dicing and removing it after dicing which produces debris-free SiO2 substrates. All products are packed in class 10 clean room conditions.
Electron Microscopy Sciences R 1.2/1.3 Holey Carbon Films, 100/PK
QUANTIFOIL is a perforated support foil with pre-defined hole size, shape and arrangement that has advantages in electron microscopy (EM) or low-energy electron point source (LEEPS) when compared with conventional holey film. QUANTIFOIL with circular holes is used in cryo-electron tomographic reconstruction. The roundness of the holes is advantageous with respect to the formation of an ice layer of constant thickness. A foil with ~1.2 µm circular holes and a spacing of ~1.3 µm between the holes. Smaller holes are designed for magnifications of 50,000x or higher. Grid: Copper. Mesh: 200 . Type: H 2 . Pitch: 127 µm.
Simpore Inc 50 nm thick Non-porous Silicon Nitride100×100 µm single window2.9 mm diameter + 0.1 mm thick chip framePack of 10
50 nm thick Non-porous Silicon Nitride100×100 µm single window2.9 mm diameter + 0.1 mm thick chip framePack of 10
Electron Microscopy Sciences AFM Substrate Type P Silicon Wafer 1", 25 mm diameter, <100> Orientation
These silicon wafers can be used for substrate studies or as substrate for AFM and SEM samples by cleaving the wafer. The wafers are polished on one side.
Diameter: 25 mm
Orientation: <100>
Thickness: 254-304 µm
Roughness: 2nm
Resistance: 1-30 ohms
Electron Microscopy Sciences Formvar/Carbon Film 25-50 nm/1 nm thick on Hexagonal 400 mesh Copper Grid
A formvar coated grid, stabilized with evaporated carbon film. This type of coating is excellent for specimen support, especially for ultra thin sections. Coated grids are optically checked followed by batch testing in the electron microscope. Packed in grid storage box. NOTE: All film is laid on the shiny side of the grid. Formvar is 25 to 50 nm thick with a 1 nm carbon coating.
Grid: Copper
Electron Microscopy Sciences Formvar/Carbon Film 10 nm/20-30 nm thick on Hexagonal 400 mesh Copper Grid
A formvar coated grid, stabilized with evaporated carbon film. This type of coating is excellent for specimen support, especially for ultra thin sections. Coated grids are optically checked followed by batch testing in the electron microscope. Packed in grid storage box. NOTE: All film is laid on the shiny side of the grid. Formvar is approximately 10 nm thick with 20 to 30 nm of carbon.
Grid: Copper
Electron Microscopy Sciences Formvar/Carbon Film 25-50 nm/1 nm thick on Hexagonal 300 mesh Gold Grid
A formvar coated grid, stabilized with evaporated carbon film. This type of coating is excellent for specimen support, especially for ultra thin sections. Coated grids are optically checked followed by batch testing in the electron microscope. Packed in grid storage box. NOTE: All film is laid on the shiny side of the grid. Formvar is 25 to 50 nm thick with a 1 nm carbon coating.
Grid: Gold
Electron Microscopy Sciences Formvar/Carbon Film 25-50 nm/20-30 nm thick on Hexagonal 400 mesh Nickel Grid
A formvar coated grid, stabilized with evaporated carbon film. This type of coating is excellent for specimen support, especially for ultra thin sections. Coated grids are optically checked followed by batch testing in the electron microscope. Packed in grid storage box. NOTE: All film is laid on the shiny side of the grid. Formvar is 25 to 50 nm thick with a 20 to 30 nm carbon coating.
Grid: Nickel
Electron Microscopy Sciences Formvar/Carbon Film 5-6 nm/1 nm thick on Hexagonal 300 mesh Nickel Grid
A formvar coated grid, stabilized with evaporated carbon film. This type of coating is excellent for specimen support, especially for ultra thin sections. Coated grids are optically checked followed by batch testing in the electron microscope. Packed in grid storage box. NOTE: All film is laid on the shiny side of the grid. Formvar is 5-6 nm thick with a 1 nm carbon coating.
Grid: Nickel
Electron Microscopy Sciences Holey Carbon Film with Ultrathin Formvar 3-4 nm thick on 300 mesh Nickel Grid
The continuous ultrathin film on holey film allows for the thinnest support film that still has adequate strength to withstand specimen preparation. Thickness: Formvar 3-4 nm. Supported by a mesh grid.
Grid: Nickel