Electron Microscopy Supplies
Thermo Scientific™ VitroEase™ Training Kit
The Thermo Scientific™ VitroEase™ Cryo-EM Training Kit provides a complete solution that includes detailed instructions for the successful preparation of grids for cryo-electron microscopy single particle analysis.
Thermo Scientific™ VitroEase™ Training Kit PROMO
The Thermo Scientific™ VitroEase™ Cryo-EM Training Kit provides a complete solution that includes detailed instructions for the successful preparation of grids for cryo-electron microscopy single particle analysis.
Electron Microscopy Sciences AFM Substrate Type P Silicon Wafer 6", 150 mm diameter, <100> Orientation
These silicon wafers can be used for substrate studies or as substrate for AFM and SEM samples by cleaving the wafer. The wafers are polished on one side.
Diameter: 150 mm
Orientation: <100>
Thickness: 600-690 µm
Roughness: 2nm
Resistance: 1-30 ohms
Simpore Inc 20 nm thick Non-porous Silicon Nitride500×500 µm single window2.9 mm diameter + 0.1 mm thick chip framePack of 10
20 nm thick Non-porous Silicon Nitride500×500 µm single window2.9 mm diameter + 0.1 mm thick chip framePack of 10
Ted Pella Inc COPPER TAPE COND.SGL ADH.
Copper Conductive Tape, 6.3mm W x 16.4m L; 1/4 in. x 18yd, Core diameter is 76mm, Foil Thickness: 0.04mm, Total Thickness: 0.07mm, Resistance through Adhesive: 0.005ohm
Ted Pella Inc CARBONTAB W/AL FOIL 12MM 100PK
Carbon Tabs with Al Foil Backing, 12 mm, 20 tabs per sheet, package of 100; TED PELLA INC mfg# 16091-12
Ted Pella Inc PELCO High Performance Silver Paste, 50g
Silver flakes in an inorganic silicate aqueous solution, specially formulated adhesive for demanding bonding applications.
Ted Pella Inc Copper/Nickel Tape, 8mm W x 20m L, each
SEM conductive tape, electrically conductive with a clean, smooth background. Nickel is embedded in the adhesive.
Ted Pella Inc PELCO TEM Grid Storage Box
Widely used compact grid box for 50 standard 3.05mm TEM grids with smoothly sliding clear plastic cover is matched to a tough, clean, self-lubricating base. The diamond-shaped grid compartments are designed to minimize awkward wrist or hand movements. The depth of the holes restricts grid movement when transported. The materials selected for the PELCO Grid Box are static dissipative to avoid static charges on the grids. Dimensions: 77.5 x 41 x 9mm.
Ted Pella Inc Carbon Tape, 8mm W x 20m L
Both sides of the tape have a thick conductive adhesive (conductive inner film is 35µm and the adhesive is 45µm on each side for a total of 125µm [5 mils]) with a white liner. The double adhesive and conductive design permits quick mounting of samples without using liquid or colloidal adhesives. The tape is relatively solid and non-porous and does not absorb small samples. The variety of widths affords efficient application to various specimen mount surface sizes. Thickness is 0.16mm. Available in six widths. Can be used down to -20°C (-4°F) and temperature maximum is 60°C (140°F). Available in 5, 8, 12, 20, 25, and 50mm W x 20m L (0.19, 0.31, 0.47, 0.79, 0.98, and 1.96" x 21.8 yd). Core diameter is 76mm (3"). SEM mounts not included.
Ted Pella Inc Carbon Tape, 20mm W x 20m L
These carbon tapes are conductive and may be used conveniently for scanning electron microscopy or EDS applications. This is the same material as the PELCO Tabs™, Carbon Conductive Tabs, but in tape form. The tape form allows for special application uses such as custom sizes, cut-outs and shapes. The purity of this tape is identical to the PELCO Tabs™; only very small impurities of Al and Si may be found. Both sides of the tape have a thick conductive adhesive (conductive inner film is 35µm and the adhesive is 45µm on each side for a total of 125µm [5 mils]) with a white liner. The double adhesive and conductive design permits quick mounting of samples without using liquid or colloidal adhesives.
Electron Microscopy Sciences AFM Substrate Ultra-Flat Silicon Wafer 4", 100 mm diameter, <100> Orientation
These ultra-flat wafers can be used for substrate studies or as substrate for AFM and SEM samples by cleaving the wafer.
Diameter: 100 mm
Orientation: <100>
Thickness: 525 µm±20 µm
Roughness: Typically 2-3Å
Resistivity: 10-20 Ohm-cm