Polishing and Abrasive Compounds
Electron Microscopy Sciences Aluminum Oxide Abrasive Discs 8", Plain backing
Alumina is widely used in sample grinding and polishing. Our Aluminum Oxide Abrasive film with a PSA back or a plain back are ready to use in all sample polishing applications.
Backing: Plain
Electron Microscopy Sciences Aluminum Oxide Abrasive Discs 8", Plain backing
Alumina is widely used in sample grinding and polishing. Our Aluminum Oxide Abrasive film with a PSA back or a plain back are ready to use in all sample polishing applications.
Backing: Plain
Electron Microscopy Sciences Aluminum Oxide Abrasive Discs 8", PSA backing
Alumina is widely used in sample grinding and polishing. Our Aluminum Oxide Abrasive film with a PSA back or a plain back are ready to use in all sample polishing applications.
Backing: PSA
Electron Microscopy Sciences Aluminum Oxide Abrasive Discs 8", PSA backing
Alumina is widely used in sample grinding and polishing. Our Aluminum Oxide Abrasive film with a PSA back or a plain back are ready to use in all sample polishing applications.
Backing: PSA
Electron Microscopy Sciences Aluminum Oxide Abrasive Discs 8", Plain backing
Alumina is widely used in sample grinding and polishing. Our Aluminum Oxide Abrasive film with a PSA back or a plain back are ready to use in all sample polishing applications.
Backing: Plain
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 0.1 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 0.1 µm
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 3 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 3 µm
Electron Microscopy Sciences Diamond Lapping Film 8", PSA Backing, 9 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: PSA
Particles: 9 µm
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 0.5 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 0.5 µm
Electron Microscopy Sciences Alumina Slurry 0.05 µm 6 OZ
These suspensions are water-based and contain no additives, which may interfere with polishing or contaminate the sample. All slurries are very stable and alumina is evenly dispersed. Excellent for the finest finishes.
Electron Microscopy Sciences Diamond Lapping Film 8", Plain Backing, 1 µm Particles
A selective diamond particle resin bonded to a uniform 3-mil polyester film backing. Excellent for polishing samples with differing hardness. Ideal for the preparation of cross sections for SEM/TEM analysis.
Backing: Plain
Particles: 1 µm
Electron Microscopy Sciences Silicone Carbide Powder, 50 µm particles 1 LB
Dark gray 98% SiC. Hardness, Moh's scale 9.0; Knoop Scale 2500. Crystallography: hexagonal–alpha and beta phase.
Size: 50 µm
Electron Microscopy Sciences Diamond Wafer Blade 4", 0.14" W, 0.20"D
The blades are constructed of an inner metal core and an outer rim with diamond particles. This diamond wafering blade has a diameter of 4" and a thickness of 0.14" W, 0.20"D.
Electron Microscopy Sciences Silicone Carbide Powder, 14 µm particles 1 LB
Dark gray 98% SiC. Hardness, Moh's scale 9.0; Knoop Scale 2500. Crystallography: hexagonal–alpha and beta phase.
Size: 14 µm
Electron Microscopy Sciences Glennel Diamond Suspension Oil Based, 1.0 µm particles 400 GR
Glennel diamond suspension assures a consistent, uniform viscosity and dispersion of diamond without any shaking or stirring. The proprietary formulation guarantees that the particles will stay suspended indefinitely. It is ideal for automatic polishers and applications that require changing operators. Consistent, uniform viscosity and dispersion of diamond without shaking or stirring. Formulation guarantees particles will stay suspended indefinitely. Ideal for automatic polishers.
Size: 1.0 µm